In the first part of the present article, the important and main methods of photolithography are reviewed and discussed. Then we introduce the ways to improve the images created on the photoresist, which is the main material of lithography. Lithography with high-energy particle and soft lithography are then described. In the second part, the contact-photolithography method and its improvement process, which we use in our laboratory, are introduced and described in detail. We used this method for lithography to make diffraction optical elements on a glass substrate, doped by silver nanoparticles, using a helium ion beam. Light diffraction from the created lithography masks prevents access to very small images. To reduce the diffraction influence on the quality of the produced elements, we adapted and optimized the contact-lithography method for our project. Our solution, presented in this article, is practical and available for other researchers in Iran
M J Madou “Fundamentals of microfabrication and nanotechnology. Manufacturing techniques for microfabrication and nanotechnology”. 3rd Edition, Vol. 2. CRC Press (2011).
K T Tran and T D Nguyen, Journal of Science: Advanced Materials and Devices2, 1 (2017) 1.
J Vinje, K S Beckwith, and P Sikorski, Journal of Microelectromechanical Systems29, 2 (2020) 160.
J E E Baglin, Applied Surface Science258, 9 (2012) 4103.
S Y Chou, P R Krauss, and P J Renstrom, Science272, 5258 (1996) 85.
M C Peckerar and J R Maldonado, Proceedings of the IEEE81, 9 (1993) 1249.
C Luo, et al., RSC Advances10, 14 (2020) 8385.
S Trivedi and H B Nemade, Sensors and Actuators B: Chemical273 (2018) 288.
A Del campo and C Greiner 17, 6 (2007) R81.
J M Shaw, et al., IBM journal of Research and Development41, 1-2 (1997) 81.
D J Carbaugh, et al., Journal of Vacuum Science and Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena35, 4 (2017) 041602.
S M Sze and M K Lee “Semiconductor devices: physics and technology”, 3rd John Wiley and sons (2012).
D Qin, et al., Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena16, 1 (1998) 98.
V Iberi, et al., Scientific reports5, 1 (2015) 1.
M Saedi, et al., Applied Surface Science507 (2020) 144951.
C A Mack “Field guide to optical lithography”, Vol 6 Bellingham, WA: SPIE Press (2006).
T Weichelt, et al., Optics Express22, 13 (2014) 16310.
A N Boto, et al., Physical Review Letters85,13 (2000) 2733.
A B Kahng, et al., IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems29, 6 (2010) 939.
P Yu, S X Shi, and D Z Pan, Journal of Micro/Nanolithography, MEMS, and MOEMS6, 3 (2007) 031004.
A Gu,and A Zakhor, IEEE Transactions on Semiconductor Manufacturing21, 2 (2008) 263.
A D Beyer, et al., IEEE Transactions on Applied Superconductivity25, 3 (2014) 1.
V Mico, Z Zalevsky, and J García, Optics communications276, 2 (2007) 209.
M D Levenson, N S Viswanathan, and R A Simpson, IEEE Transactions on electron devices29, 12 (1982) 1828.
K G Winkels, et al., The European Physical Journal Special Topics, 192(1) (2011) 195.
M Lysaght, et al., Physical Review A72, 1 (2005) 014502.
J Suzuki, et al., Journal of Photopolymer Science and Technology30, 6 (2017) 671.
N Mojarad, J Gobrecht, and Y Ekinci, Scientific reports5, 1 (2015) 1.
H Ito and C G Willson, Polymer Engineering and Science23, 18 (1983) 1012.
C T Lee, “Development and advanced characterization of novel chemically amplified resists for next-generation lithography”, Thesis for the Ph.D. Degree, Georgia Institute of Technology, School of Chemical and Biomolecular Engineering (2008).
E Reichmanis, et al., Polymer International48, 10 (1999) 1053.
M Krysak, et al., In Advances in Resist Materials and Processing Technology XXVIII 7972 (2011) 79721C.
S Ghosh, et al., RSC advances6, 78 (2016) 74462.
D De Simone, Y Vesters, and G Vandenberghe, Advanced Optical Technologies6, 3-4 (2017) 163
H Ghasem, F Saeidi, and E Ahmadi, Journal of Instrumentation8, 02 (2013) 02023.
A Heuberger, Journal of Vacuum Science and Technology B: Microelectronics Processing and Phenomena6, 1 (1988) 107.
J M Park, et al., Materials12, 13 (2019) 2056.
K Kise, et al., Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena22, 1 (2004) 126.
M Farhoud, et al., Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena17, 6 (1999) 3182.
Y Shimizu, Nanomanufacturing and Metrology4 (2021) 3.
D Weber, et al., Applied Physics A125, 5 (2019) 1.
R Sidharthan, F Chollet, and V M Murukeshan, Laser Physics19, 3 (2009) 505.
E Buitrago, et al., Microelectronic Engineering155 (2016) 44.
E M Park, et al., Thin Solid Films519, 13 (2011) 4220.
A E Grigorescu and C W Hagen, Nanotechnology20, 29 (2009) 292001.
C Vieu, et al., Applied surface science164, 1-4 (2000) 111.
S Reyntjens and R Puers, Journal of Micromechanics and Microengineering11, 4 (2001) 287.
J Zhang, C Con, and B Cui, ACS Nano8, 4 (2014) 3483.
P R Munroe, Materials Characterization60, 1 (2009) 2.
C A Volkert, and A M Minor, MRS Bulletin32, 5 (2007) 389.
M I Current, Materials Science in Semiconductor Processing62 (2017) 13.
M Horák, et al., Scientific Reports8, 1 (2018) 1.
O Dial, C C Cheng, and A Scherer, Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena16, 6 (1998) 3887.
F Watt, et al., International Journal of Nanoscience4, 03 (2005) 269.
S Chou, Y P R Krauss, and P J Renstrom, Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena14, 16 (1996) 4129.
U Plachetka, et al., Microelectronic Engineering73 (2004) 167.
Y Xia and G M Whitesides, Annual Review of Materials Science28, 1 (1998) 153.
T A Kumar, et al., Nano letters10, 6 (2010) 2262.
S T Howell, et al., Microsystems and Nanoengineering6, 1 (2020) 1.
Y K Ryu and R Garcia, Nanotechnology28(14) (2017) 142003
Y Wang, et al., Nano Today22 (2018) 36.
C Wang, et al., Micromachines7, 7 (2016) 118.
X Niu, et al., Microelectronic engineering87, 5-8 (2010) 1168.
Y K Yoon, J H Park, and M G Allen, Journal of microelectromechanical systems15, 5 (2006) 1121.
C M Waits, et al., Sensors and Actuators A: Physical119, 1 (2005) 245.
I Bernardeschi, M Ilyas, and L Beccai, Advanced Intelligent Systems3 (2021) 2100051.
G Seniutinas, et al., Microelectronic Engineering191 (2018) 25
R R Schaller, IEEE Spectrum34, 6 (1997) 52.
T S Kulmala, et al., Journal of Micro/Nanolithography, MEMS, and MOEMS14, 3 (2015) 033507.
T Tamulevičius, et al., Experimental Techniques32, 4 (2008) 23.
C J Ting, C F Chen, and C P Chou, Optics Communications282, 3 (2009) 434.
Y Chen, Microelectronic Engineering135 (2015) 57.
A N Abbas, et al., ACS nano8, 2 (2014) 1538.
A Rashidian, et al., Journal of Micromechanics and Microengineering20, 2 (2010) 025026.
A Nahal, M Mahjour-Shafiei, and S R Hosseini, Journal of Materials Science: Materials in Electronics31 (2020) 5499.
A Nahal, S R Hosseini, and M Mahjour-Shafiei, Journal of Materials Science: Materials in Electronics32, 18 (2021) 23349.
D M Mattox, “Film Formation, Adhesion, Surface Preparation, and Contamination Control, Handbook of physical vapor deposition (PVD) processing”, 2nd Edition, Noyes Publications, Westwood, New Jersey, USA (1998).
V I Egorkin, et al., Russian Microelectronics46, 4 (2017) 272.
P Walker and W H Tarn, (Eds.), “CRC Handbook of Metal Etchants”, CRC Press (1990).
Nahal,A. and Hosseini,S. R. (2022). An introduction to lithography methods and providing a practical method for its optimization. Iranian Journal of Physics Research, 22(1), 1-14. doi: 10.47176/ijpr.22.1.31218
MLA
Nahal,A. , and Hosseini,S. R. . "An introduction to lithography methods and providing a practical method for its optimization", Iranian Journal of Physics Research, 22, 1, 2022, 1-14. doi: 10.47176/ijpr.22.1.31218
HARVARD
Nahal A., Hosseini S. R. (2022). 'An introduction to lithography methods and providing a practical method for its optimization', Iranian Journal of Physics Research, 22(1), pp. 1-14. doi: 10.47176/ijpr.22.1.31218
CHICAGO
A. Nahal and S. R. Hosseini, "An introduction to lithography methods and providing a practical method for its optimization," Iranian Journal of Physics Research, 22 1 (2022): 1-14, doi: 10.47176/ijpr.22.1.31218
VANCOUVER
Nahal A., Hosseini S. R. An introduction to lithography methods and providing a practical method for its optimization. Dear user; Recently we have changed our software to Sinaweb. If you had already registered with the old site, you may use the same USERNAME but you need to change your password. To do so at the first use, please choose, 2022; 22(1): 1-14. doi: 10.47176/ijpr.22.1.31218